Let's explore the production process of copper-clad steel together!

Comparing copper-clad steel electroplating vs. cold rolling: cold rolling offers stronger bonding, higher conductivity, and corrosion resistance.

On February 17th, the International Defence Exhibition & Conference (IDEX 2025) in Abu Dhabi officially kicked off. As a leading enterprise in the field of copper-clad steel composites, Suzhou Shenlong New Materials Technology Co., Ltd. (SLXCL) made a splendid debut at Booth C1-03B, attracting numerous international clients to stop by for inquiries.

Let's take a look together and learn more about the rolling mills we use.

Shenlong New Materials Technology Co., Ltd. ensures the safe, convenient, and cost-effective transportation of copper-clad steel composite materials through various efficient packaging solutions, including open flat packaging, roll packaging, and wooden pallet packaging.

Copper-steel composite materials, with their excellent strength, heat resistance, corrosion resistance, and high precision, are widely used in military ammunition manufacturing, enhancing production efficiency and product quality.

Copper-clad steel composites, with their unique structure and excellent performance, are the preferred cost-saving material in engineering. They reduce material costs and simplify procurement, achieving significant economic benefits. Future prospects are broad.

Copper-clad steel, a novel material that prioritizes both high strength and corrosion resistance, offers efficient, reliable, and cost-effective solutions, empowering industry progress.

This article delves into the performance disparities among copper-clad steel, pure copper, and pure steel in terms of conductivity, thermal conductivity, strength, corrosion resistance, and cost. Let’s exploring these differences.

The perfect combination of the outer copper layer and the inner steel core enables copper-clad steel materials to reduce costs while enhancing performance, making them a cost-effective choice across multiple industries.