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Copper Clad Steel Composite Metal Strip for Computer Graphics Card Heat Sink
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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T2+Steel+T2 Copper-clad Steel Composite Metal Material for Heat Sink
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Copper-clad Steel Composite Metal Materials for Mobile Phone Parts
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Copper Clad Steel Double-layer Metal Composite Materials for Various Mobile Phone Heat Dissipation Applications
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Copper Clad Steel Metal Strip for Computer Graphics Cards
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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High-performance Copper Clad Steel Composite Metal Raw Material for Computer Heatsink
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Copper Clad Steel Composite Metal Material for Laptop Heat Sink
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Efficient Heat Dissipation Copper-clad Steel Composite Metal Copper Sheet
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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Multiple Specifications Mobile Phone Repair Cooling Copper High-End Notebook Copper Heat Sink Computer Graphics Card Heat Sink Copper Sheet
Thickness: 0.05~3.0mm
Base Metal: IF, 304, SPCC
Cladding Metal: T2
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