Revolutionizing Smartphone Cooling with Ultra-Thin T2+304 Copper-Clad Steel

Thermal management is crucial for maintaining the peak performance of smartphone devices. Overheating can reduce efficiency, shorten battery life, and compromise user experience. This is where T2+304 copper-clad steel comes in—a revolutionary material engineered to address these challenges with exceptional precision.

SLXCL's advanced T2+304 copper-clad steel can be manufactured as thin as 0.06mm. With our 20-roll rolling mill, the minimum thickness that can be rolled is 0.06 millimeters. This ultra-thin design allows it to integrate seamlessly into compact smartphone chipset and various electronic accessories.. Despite its slim profile, it delivers outstanding heat dissipation, ensuring devices run cooler and more efficiently.

By combining the strength of steel with the superior thermal conductivity of copper, T2+304 achieves a perfect balance of durability and performance. It effectively draws heat away from critical components, preventing overheating and extending the lifespan of smartphone accessories.

For manufacturers and designers, this material opens up new possibilities for innovation.

Ready to enhance your thermal management solutions? Let’s connect and explore how T2+304 copper-clad steel can elevate the performance of smartphone accessories.